Established Hop Cheng Technology Corporation in Nanshan Road, Luzhu Township, Taoyuan with registered capital of NT$28 million. Main business included manufacturing, laminating, R&D and trading of multilayer laminated substrates and electronic components. Multilayer laminated substrate production quality was certified by UL.
Mass Production
1996
Started mass production of glass fiber prepreg and copper clad laminate.
OTC Application
1998
Warehouse automation under construction. Applied for stock trading at the Taiwan OTC Exchange. After capital increase from retained earnings and employee bonuses, paid-in capital reached NT$509,690 thousand.
Organizational Restructuring
2000
Former General Manager Mr. Zhang Bingmu was promoted to Vice Chairman, succeeded by Dr. Hsiao Ming-Cheng. After capital increase from retained earnings, employee bonuses and capital reserve, paid-in capital reached NT$1,014,700 thousand.
Investment in China
2002
Approved by the Investment Commission to indirectly invest in Kunshan Hop Cheng Electronic Technology Company in China. Capital increase from retained earnings brought paid-in capital to NT$1,472,630 thousand. Received subsidies from the Industrial Development Bureau and participated in the program to encourage private enterprises to develop new industrial products.
Patent Acquisition
2004
Obtained patents for 'Build-up Method with Bonding Resin for PCB', 'High Thermal Conductivity Halogen-Free Phosphorus-Free Flame Retardant Resin Composition for PCB Materials', and 'Aluminum Composite Substrate'. Capital after conversion reached NT$1,893,666 thousand.
Bond Conversion
2006
First domestic secured convertible bonds fully converted, bringing capital to NT$2,501,618 thousand. Obtained patent for 'Heat Dissipation Auxiliary Plate for High-Speed Drilling'.
Bond Issuance
2008
Cancelled treasury stock capital of NT$5,000 thousand, reducing capital to NT$2,496,618 thousand. Issued second domestic secured convertible bonds totaling NT$300,000 thousand.
Bond Conversion
2010
Cancelled treasury stock capital of NT$32,000 thousand, reducing capital to NT$2,837,545 thousand. 974 units of second domestic secured convertible bonds converted to common shares, bringing capital to NT$3,016,918 thousand.
Capital Reduction
2012
Obtained multiple utility model patents in Taiwan and China. Executed capital reduction to offset accumulated losses, reducing capital to NT$1,870,543,880.
Subsidiary Establishment
2014
Disposed of partial land and buildings in Zhonggong Section, Zhongli District, Taoyuan. Established Hong Cheng Industrial Corporation in April 2014.
Investment Restructuring
2017
Disposed of investee companies Hop Cheng International Corporation and Hong Kong Yida Company. Private placement of 98,040 thousand common shares. Capital reduction to offset losses brought capital to NT$1,801,568,370.
Subsidiary Formation
2019
Established Taiwan subsidiary Hong Cheng Technology Corporation
Investment Company Establishment
2022
Established Taiwan subsidiary Rui He Investment Corporation
Restricted Stock for Employees
2024
Issued 4,050 thousand restricted employee shares, bringing capital to NT$2,142,068 thousand after capital increase.
Growth and Transformation
Capital Increase and Relocation
1995
Conducted two cash capital increases totaling NT$146,118 thousand, raising total capital to NT$174,118 thousand. Relocated to current address at No. 38-1, Dongyuan Road, Zhongli Industrial Park, Taoyuan. Expanded substrate plant and commenced upstream material production including glass fiber prepreg and copper clad laminate.
Technical Breakthrough and Certification
1997
Completed development of 14-layer PCB and received production orders from Chunghwa Telecom Research Institute. Passed ISO 9002 quality certification by the Bureau of Standards, Metrology and Inspection. Capital increase from retained earnings, capital reserve and cash raised capital to NT$420,000 thousand.
OTC Listing
1999
Approved by the Taiwan OTC Exchange and Securities and Futures Commission to become an OTC-listed company. Capital increase from retained earnings and cash raised capital to NT$841,000 thousand. Approved by the Investment Commission to indirectly invest in Huizhou Hop Cheng Electronic Technology Company in China.
Corporate Bond Issuance
2001
Issued first domestic unsecured convertible bonds totaling NT$800,000 thousand. After capital increase from retained earnings, employee bonuses and capital reserve, paid-in capital reached NT$1,316,923 thousand.
R&D Subsidy
2003
Received Industrial Development Bureau subsidy for preliminary development of embedded resistor-capacitor materials under Industry-Academia Collaboration Program. Issued first overseas unsecured convertible bonds totaling USD 9,400 thousand.
Continuous Capital Increase
2005
Issued first domestic secured convertible bonds totaling NT$370,000 thousand. Capital increase from retained earnings of NT$47,348 thousand brought paid-in capital to NT$1,941,013 thousand. Obtained patent for 'High Heat Dissipation Lubricating Aluminum Cover Plate for Drilling and Its Process'.
Patent Expansion
2007
Obtained patents for 'Halogen-Free Phosphorus-Free Resistor Ink Manufacturing Method and Its Application', 'Processing Method and Device for Dielectric Materials', and 'Auxiliary Material for Extending High-Speed Drill Bit Life'.
International Certification
2009
Passed UL certification for high thermal conductivity PCB. Invention 'High Heat Dissipation Lubricating Aluminum Cover Plate for Drilling and Its Manufacturing Method' officially obtained Japanese patent. After second domestic secured convertible bond conversion, capital reached NT$2,869,545 thousand.
Technical Patents
2011
Obtained patents for 'Formulation and Manufacturing Method of Build-up Bonding Adhesive (RCTC)' and 'Manufacturing Method of Build-up Bonding Adhesive with High Thermal Conductivity and Low Dissipation Factor'.
Investment Disposal
2013
Obtained patents for 'Multilayer PCB Structure', 'Multilayer Drilling Cover Plate', 'Drilling Auxiliary Plate for PCB', and 'Thermosetting Resin Composition'. Disposed of investee Huizhou plant in China. Indirectly invested in Ding Zuan (Shenzhen) Company in China.
Asset Disposal
2015
Disposed of investee Kunshan plant and Ding Zuan (Shenzhen) plant in China. Disposed of land and buildings at Zhonggong Section 38-1, Zhongli District, Taoyuan.
Change of Responsible Person
2018
Changed responsible person to Li Chih-Cheng, representative of You De Investment Corporation
Board Re-election
2021
On January 29, 2021, the extraordinary shareholders' meeting re-elected all directors (including independent directors), and the responsible person was changed to Tu Jun-Guang.
Acquisition of San Jiang Electric
2023
Announced acquisition of 76.49% common stock of San Jiang Electric Enterprise Corporation with total investment of NT$1.294 billion. Through simplified merger of San Jiang Electric and Jiang Fu Enterprise, Hop Cheng acquired 100% common stock of San Jiang. Private placement of 30,000 thousand common shares brought capital to NT$2,101,568 thousand.
Company Rename
2025
Company renamed from 'Uniplus Electronics Co., Ltd.' to 'Spectrum Electrics Corporation'. Approved by the Ministry of Economic Affairs on November 25, 2025. English name changed from UNIPLUS ELECTRONICS CO.,LTD. to Spectrum Electrics Corporation. Stock abbreviation changed to 'Spectrum', stock code remains '5381'.
